Microelectromechanical microphone with membrane trench reinforcements and method of fabrication

ABSTRACT

A microelectromechanical (MEMS) microphone with membrane trench reinforcements and method of fabrication is provided. The MEMS microphone includes a flexible plate and a rigid plate mechanically coupled to the flexible plate. The MEMS microphone includes a stoppage member affixed to the rigid plate and extending perpendicular relative to a surface of the rigid plate opposite the surface of the flexible plate. The stoppage member limits motion of the flexible plate. The rigid plate includes a reverse bending edge that include a first lateral etch stop that includes a first corner radius and a second lateral etch stop that includes a second corner radius. The first corner radius is more than 100 nanometers and the second corner radius is more than 25 nanometers. Further, a lateral step width between the first corner radius and the second corner radius is less than around 4 micrometers.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of and priority to U.S. ProvisionalApplication No. 63/020,216, filed May 5, 2020, entitled “PROCESS FLOWFOR MEMS MICROPHONE,” and U.S. Provisional Application No. 63/066,652,filed Aug. 17, 2020, entitled “PROCESS FLOW FOR MEMS MICROPHONE.” Thecontent of the above applications are hereby expressly incorporated byreference herein in their entireties.

BACKGROUND

Micro-Electro-Mechanical Systems (MEMS) is a class of structures and/ordevices that are fabricated using semiconductor-like processes. MEMSstructures and/or devices exhibit mechanical characteristics thatinclude the ability to move or to deform. Examples of MEMS devicesinclude, but are not limited to, gyroscopes, accelerometers,magnetometers, pressure sensors, radio-frequency components, and so on.Silicon wafers that include MEMS structures are referred to as MEMSwafers. Unique challenges exist to provide MEMS devices and/orstructures with improved performance and reliability.

BRIEF DESCRIPTION OF THE DRAWINGS

Various non-limiting embodiments are further described with reference tothe accompanying drawings in which:

FIGS. 1-36 illustrate example, non-limiting, cross-sectional views of aMEMS microphone undergoing a fabrication process in accordance with oneor more embodiments described herein;

FIG. 37 illustrates an example representation of a MEMS microphoneaccording to one or more embodiments described herein;

FIG. 38 illustrates a further example representation of a MEMSmicrophone according to one or more embodiments described herein; and

FIG. 39 illustrates another example representation of a MEMS microphoneaccording to one or more embodiments described herein.

DETAILED DESCRIPTION

One or more embodiments are now described more fully hereinafter withreference to the accompanying drawings in which example embodiments areshown. In the following description, for purposes of explanation,numerous specific details are set forth in order to provide a thoroughunderstanding of the various embodiments.

FIGS. 1-36 illustrate example, non-limiting, cross-sectional views of aMEMS microphone undergoing a fabrication process in accordance with oneor more embodiments described herein.

FIG. 1 illustrates a cross-sectional view of a first stage of formationof a MEMS microphone in accordance with one or more embodimentsdescribed herein. At the first stage, a wafer 102 (e.g., a wafersubstrate) can undergo ion implantation. The substrate can comprisealuminum copper or silicon, for example. According to an implementation,the ion implantation of the wafer 102 can be a phosphorusion-implantation. Additionally, the ion implantation can be a processmodule bulk doping.

As indicated at FIG. 2 , a low-stress silicon nitride thin film (LSNthin film) can be deposited on the wafer 102. More specifically, a firstLSN thin film 202 ₁ can be deposited on a first surface (e.g., a firstside 204) of the wafer 102 and a second LSN thin film 202 ₂ can bedeposited on a second surface (e.g., a second side 206) of the wafer102. As illustrated, the first side 204 and the second side 206 are onopposite sides of the wafer 102.

One or more cavities can be etched on the first side 204, through thefirst LSN thin film 202 ₁ and into the wafer 102, as indicated at FIG. 3. For example, illustrated are three cavities, labeled as a first cavity302 ₁, a second cavity 302 ₂, and a third cavity 302 ₃. A cavity refersto an opening or recession in a substrate layer (e.g., the wafer 102).In the example illustrated, there are three cavities, however, anothernumber of cavities (e.g., one or more) can be formed in the wafer 102according to various implementations. The one or more cavities can beetched via a Deep Reactive-Ion Etching (DRIE) process. In someimplementations, a first mask (M1) can be utilized to etch the one ormore cavities.

According to some implementations, etching the first cavity 302 ₁ andthe second cavity 302 ₂ can be referred to as a front cavity etch.Further to these implementations, the first cavity 302 ₁ can be referredto as a first front cavity and the second cavity 302 ₂ can be referredto as a second front cavity, or collectively as front cavities.

According to some implementations, the one or more cavities can bearound 4 micrometers (4 μm) donut ring that can absorb DRIE positioninaccuracy. Further, the one or more cavities can define a distance to amembrane stopper and a lateral etch stop 1 (LES 1), which will bediscussed in further detail below.

FIG. 4 illustrates a stage of the fabrication process that includesdepositing a first oxide layer. Depositing the first oxide layer caninclude filling the one or more cavities by performing oxide deposition,according to an embodiment. As indicated, a first oxide layer 402 isdeposited on the first side 204 of the wafer 102. The first oxide layer402 is deposited over the first LSN thin film 202 ₁. Further, the firstoxide layer 402 can be deposited within the one or more cavities (e.g.,the first cavity 302 ₁, the second cavity 302 ₂, and the third cavity302 ₃). As indicated, the first oxide layer 402 that is deposited withinthe one or more cavities is deposited over portions of the wafer 102exposed by the one or more cavities. Further, the first oxide layer 402is deposited on respective sides of the one or more cavities, adjacentthe wafer 102 and adjacent the first LSN thin film 202 ₁. The firstoxide layer 402 can comprise, for example, tetraethyl orthosilicate(TEOS), also referred to as tetraethoxysilane.

Reverse etch of the filling oxide (e.g., the first oxide layer 402) canbe performed at a next stage of the fabrication process, as illustratedin FIG. 5 . The reverse etch can facilitate etching of the first oxidelayer 402 at one or more portions of the first oxide layer 402 that arenot located at the areas associated with the one or more cavities (e.g.,the first cavity 302 ₁, the second cavity 302 ₂, and the third cavity302 ₃). Example one or more portions of the first oxide layer 402 thatcan be etched are indicated at first portion 502, second portion 504,third portion 506, and fourth portion 508. The first portion 502represents the portion between the left edge of the device (e.g., leftedge when looking at FIG. 5 ) and the first cavity 302 ₁. The secondportion 504 represents the portion between the first cavity 302 ₁ andthe second cavity 302 ₂. The third portion 506 represents the portionbetween the second cavity 302 ₂ and the third cavity 302 ₃. The fourthportion 508 represents the portion between the third cavity 302 ₃ andthe right edge of the device (e.g., right edge when looking at FIG. 5 ).

The reverse etch can include removing the filling oxide (e.g., the firstoxide layer 402) via Reactive-Ion Etching (RIE) prior to performing aCMP process, as indicated in FIG. 6 . Upon or after the CMP process, oneor more portions of the first oxide layer 402 remain at the areascorresponding to the one or more cavities (e.g., filled cavities), asindicated by first cavity filled with the first oxide layer 402 ₁,second cavity filled with the first oxide layer 402 ₂, and third cavityfilled with the first oxide layer 402 ₃.

The respective centers of the front cavities are indicated by a firstdashed line 602 for the first cavity 302 ₁ and a second dashed line 604for the second cavity 302 ₂.

FIG. 7 illustrates deposition of base oxide 702 during a next stage ofthe fabrication process. The base oxide 702 can be deposited over thefirst LSN thin film 202 ₁, over the first cavity filled with the firstoxide layer 402 ₁, over the second cavity filled with the first oxidelayer 402 ₂, and over the third cavity filled with the first oxide layer402 ₃. The base oxide 702 can comprise TEOS, for example.

It is noted that, the front cavities can reduce the capacitive couplingbetween the membrane and the backplane through the bulk. The frontcavities also can reduce the signal loss. It is noted that theillustrated example includes one decoupling capacitor, however, otherdecoupling capacitors can be included at different locations.

FIG. 8 illustrates membrane protection layer (MPL) deposition. MPL 802 ₁can be deposited over the base oxide 702 on the first side 204. Further,MPL 802 ₂ can be deposited over the second LSN thin film 202 ₂ on thesecond side 206.

The MPL 802 ₁ can be a polysilicon protection layer on the backside(e.g., the first side 204). A thickness of the MPL 802 ₁ can around 100nm. In some implementations, the MPL 802 ₁ can be less than about 500nm. Further, the MPL 802 ₁ can facilitate control of a ventilation holedimension (e.g., mitigates degradation of the ventilation holedimension), protecting the performance of the cutoff frequency.

The MPL 802 ₁ and/or the MPL 802 ₂ can protect the membrane LSN (e.g.,the first LSN thin film 202 ₁, the second LSN thin film 202 ₂) againstvarious fabrication processes including Buffered Oxide Etch (BOE), andhigh frequency or very High Frequency (vHF) experienced during varioususe case situations. It is noted that the MPL 802 ₁ and/or the MPL 802 ₂is an intermediate layer(s) that will be removed later in thefabrication process.

Upon or after deposition of the MPL 802 ₁, structuring of the MPL 802 ₁is performed, as indicated in FIG. 9 . The structuring of the MPL 802 ₁can include retaining a portion of the MPL 802 ₁ that is located overthe first cavity 302 ₁, over the second cavity 302 ₂, and over the areabetween the first cavity 302 ₁ and the second cavity 302 ₂ (or over thefirst cavity filled with the first oxide layer 402 ₁ and the secondcavity filled with the first oxide layer 402 ₂). The portion of the MPL802 ₁ that is retained is indicated at portion 902. For example, theportion of the MPL 802 ₁ that is retained extends from about a firstside 904 of the first cavity filled with the first oxide layer 402 ₁ toabout a second side 906 of the second cavity filled with the first oxidelayer 402 ₂. The other portions of the MPL 802 ₁ (indicated at portion908 and portion 910) are removed during the structuring of the MPL 802₁. The remaining portion of the MPL 802 ₁ (indicated at portion 902)helps to protect against over-etching nitride of the membrane (whichwill be deposited later in the fabrication process).

According to some implementations, a width of the two front cavitiesfrom center to center (e.g., between the first dashed line 602 and thesecond dashed line 604) is about at least around 20 micron wide. Thecavity etching from the backside is targeted at the respective centersof the front cavities (which will be discussed with respect to FIG. 33). Thus, slight variations, such as plus or minus half the width astolerance on the cavity position during the etch can be tolerated, whichcan facilitate manufacturability of the fabrication process. Thus, someinaccuracy during the fabrication process and the alignment can beabsorbed at the front cavities as provided herein. Otherwise,appropriate positioning of the cavities might not be achieved.

FIG. 10 illustrates structuring of a membrane stopper according to anembodiment. Structuring the membrane stopper can include etching thebase oxide 702 at the portions that are not covered by the MPL 802 ₁, orthe portions indicated at portion 908 and portion 910 (refer to FIG. 9). For example, at portion 908, a first area 1002 and a second area 1004of the base oxide 702 can be removed. Further, at portion 910, a scribeline and the bulk contact to the right (as looking at FIG. 10 ) can beopened up, which can include etching or removal of the base oxide 702 ata third area 1006 (shown in the enlarged view), a fourth area 1008, anda fifth area 1010. The etching can be in the range of around 0.95 micronfor the membrane stopper dimension. The etch should be controlled downto the nitride (e.g., the first LSN thin film 202 ₁) to provide adefined amount of material when entering the release process, which isperformed near the end of the fabrication process, as will be discussedfurther below.

The membrane stopper can dimple towards the bulk (e.g., towards thewafer 102). Such removal of the base oxide 702 to create the membranestopper can reduce stress in the LES1, or the suspension area.

A second oxide layer can be deposited, as illustrated in FIG. 11 . Insome cases, the second oxide layer can be referred to as a membranestopper spacer. For example, a portion of the second oxide layer(indicated by second oxide layer 1102 ₁) can be deposited over andadjacent the MPL 802 ₁. Further, the second oxide layer 1102 ₁ can bedeposited over and adjacent the base oxide 702 and over the first LSNthin film 202 ₁. The second oxide layer 1102 ₁ can be deposited adjacentthe MPL 802 ₁ at a first side of the MPL 802 ₁ located near the firstside 904 of the first cavity filled with the first oxide layer 402 ₁ anda second side of the MPL 802 ₁ located near the second side 906 of thesecond cavity filled with the first oxide layer 402 ₂. The second oxidelayer 1102 ₁ can be deposited adjacent the base oxide 702 at theportions where the base oxide 702 was removed, such as the portions ofthe base oxide that form at least one wall (or side) of the first area1002, the walls of the second area 1004, the walls of the third area1006 (see the enlarged view of the indicated area in FIG. 11 ), thewalls of the fourth area 1008, and at least one wall of the fifth area1010.

Further, another portion of the second oxide layer (indicated by secondoxide layer 1102 ₂) can be deposited on the second side 106 and over theMPL 802 ₁.

The second oxide layer 1102 ₁ can be an intermediate layer forcontrolling a distance between the surface and the membrane stopper. Itis noted that the membrane stopper is configured to control the distanceto the surface. According to some implementations, the membrane stopperhas a targeted distance of about 250 nm (plus or minus around 50 nm).The second oxide layer 1102 ₁ is an oxide layer that defines thedistance during a release etch, which will be discussed in furtherdetail below. The second oxide layer 1102 ₁ (and the second oxide layer1102 ₂) can comprise silicon oxide, which can be a TS oxide deposited inthe range of around 50 nm to about 100 nm, depending on the fabricationprocess. In some implementations, the second oxide layer 1102 ₁ (and thesecond oxide layer 1102 ₂) can have a targeted thickness of around 100nm.

FIG. 12 illustrates structuring (e.g., opening) a first lateral etchstop (e.g., lateral etch stop 1). The lateral etch stop structuring caninclude etching the second oxide layer 1102 ₁ and the base oxide 702 atone or more areas. For example, the second oxide layer 1102 ₁ and thebase oxide 702 can be etched at a first area 1202 (see enlarged portionon left side of FIG. 12 ) and at a second area 1204 (see enlargedportion on right side of FIG. 12 ). More specifically, the second oxidelayer 1102 ₁ and the base oxide 702 can be etched down to (or theetching can be stopped at) the first LSN thin film 202 ₁ as indicated bythe first area 1202 and the second area 1204. This etching can bereferred to as an over-etch according to some implementations. Upon orafter etching, a CMP process can be performed on the exposed first LSNthin film 202 ₁. The first LSN thin film 202 ₁ can comprise a thicknessof around 50 nm according to some implementations.

The lateral etch stop can be structured in order to meet a definedspecification for a corner radius. For example, the definedspecification can be that the corner radius is to be more than around100 nm. The corner radius area for the first area 1202 is indicated as afirst corner 1206 (e.g., a first corner radius) and the corner radiusarea for the second area 1204 is indicated as a second corner 1208(e.g., a second corner radius). The first corner 1206 and the secondcorner 1208 represent the two inner corner radiuses. The etch processcan be designed to provide the required corner radius.

Optionally, second LSN thin film 202 ₂ reinforcement deposition and etch(not shown in FIG. 12 ) can be performed during this stage of thefabrication process.

FIG. 13 illustrates an optional stage of the fabrication process thatincludes depositing and structuring (e.g., etching) a nitridereinforcement layer. For example, nitride reinforcement layer 1302 ₁ canbe deposited (at the first side 204) over and adjacent the second oxidelayer 1102 ₁, over and adjacent the base oxide 702, and over the firstLSN thin film 202 ₁. For example, the nitride reinforcement layer 1302 ₁can be deposited adjacent the base oxide 702 at walls defined for thefirst area 1202 and walls defined for the second area 1204. Further, thenitride reinforcement layer 1302 ₁ can be deposited over the first LSNthin film 202 ₁ at the bottom of the first area 1002 and the bottom ofthe fifth area 1010.

This stage of the fabrication process can be referred to as a membraneLSN1 deposition. Additionally, nitride reinforcement layer 1302 ₂ can bedeposited over the second oxide layer 1102 ₂ at the second side 206.

Further, as illustrated in FIG. 14 , a first membrane nitride layer canbe deposited. For example, the first membrane nitride layer 1402 ₁ canbe deposited over and adjacent the nitride reinforcement layer 1302 ₁.Further, another first membrane nitride layer 1402 ₂ can be deposited,at the second side 206, over the nitride reinforcement layer 1302 ₂. Thefirst membrane nitride layer can be a membrane In-Situ Doped Polysilicon(ISDP), which can be deposited and annealed.

FIG. 15 illustrates a next stage of the fabrication process thatincludes etching the first membrane nitride layer 1402 ₁. A trench 1502is formed (etched) in the first membrane nitride layer 1402 ₁. Forexample, the first membrane nitride layer 1402 ₁ can be etched (down) toa top surface of the nitride reinforcement layer 1302 ₁. The trench 1502can comprise bottom corners, illustrated as first corner 1504 and asecond corner 1506. The corners can have a respective radiusspecifications of more than about 50 nm. The trench width can be 8 μm or4 μm reinforcement.

According to some implementations, other processes that can be performedinclude definition of an active electrode area and shield. Anotherprocess can include opening ventilation hole area in ISDP (8 μm).Further, opening of bulk contact, with donut, can be performed.Additionally, opening of the scribe line can be performed while leavingedge cover on scribe. Another process can be definition of die ID.

An oxide reinforcement layer 1602 can be deposited over and adjacent thefirst membrane nitride layer 1402 ₁ and over the nitride reinforcementlayer 1302 _(1,) as illustrated in FIG. 16 . This step can also bereferred to a top reinforcement deposition.

FIG. 17 illustrates structuring of the oxide reinforcement layer 1602.As illustrated, in the enlarged portion, various portions of the oxidereinforcement layer 1602 can be removed (e.g., etched). After theetching, the portion of the oxide reinforcement layer 1602 at the trench1502 remains (indicated at 1702 in the enlarged portion of FIG. 17 ).

A next stage of the fabrication process includes deposition of a secondmembrane nitride layer, as illustrated in FIG. 18 . The second membranenitride layer can be a LSN thin film, according to some implementations.For example, second membrane nitride layer 1802 ₁ can be depositedadjacent and over the first membrane nitride layer 1402 ₁. Further, thesecond membrane nitride layer 1802 ₁ can be deposited adjacent and overthe portion of the oxide reinforcement layer 1602 over the trench 1502.Additionally, the second membrane nitride layer 1802 ₁ can be depositedover the first LSN thin film 202 ₁. Further, second membrane nitridelayer 1802 ₂ can be deposited over the first membrane nitride layer 1402₂ on the second side 206 of the wafer.

FIG. 19 illustrates creation of one or more ventilation holes. The oneor more ventilation holes can be formed by etching down through thesecond membrane nitride layer 1802 ₁ and the first membrane nitridelayer 1402 ₁. As illustrated, one or more ventilation holes can beformed, as indicated by first ventilation hole 1902, second ventilationhole 1904, and third ventilation hole 1906. Although three ventilationholes are illustrated and described, in some implementations, anothernumber of ventilation holes can be formed.

Next, a third oxide layer 2002 is deposited, as illustrated in FIG. 20 .The third oxide layer 2002 can be deposited over and adjacent the secondmembrane nitride layer 1802 ₁ and over the first LSN thin film 202 ₁(e.g., at the first area 1002 and at the fifth area 1010). The thirdoxide layer can also be referred to as a first airgap oxide (e.g.,airgap oxide 1).

Dimple formation and second Lateral Etch Stop (LES2) definition can beperformed as illustrated in FIG. 21 . As indicated, one or more dimplesand the second lateral etch stop can be formed (e.g., opened) in thethird oxide layer 2002. For example, the one or more dimples and secondlateral etch stop can be formed (e.g., etched) in the third oxide layer2002. FIG. 22 illustrates a next stage of the fabrication process thatincludes depositing a fourth oxide layer 2202. The fourth oxide layer2202 can also be referred to as an airgap oxide 2 deposition.

FIG. 23 illustrates opening the second lateral etch stop area, which caninclude structuring and etching. Opening the second lateral etch stoparea can include etching the third oxide layer 2002 and the fourth oxidelayer 2202.

There are two corner radiuses on the lateral etch stops, illustrated asa first corner 2302 and a second corner 2304. The first corner 2302 canhave a radius of more than about 100 nm. The second corner 2304 can havea radius of more than 25 nm. Further, a step width 2306 (lateral stepwidth) can be around 4 μm. It is noted that the radius is toward thecenter of the microphone (indicated within the enlarged portion 2308).

The process of forming the two radiuses (e.g., at the first corner 2302and at the second corner 2304) can be a two mask process. For example,the areas on the two outer edges can be structured. Then oxide can bedeposited. Upon or after deposition of the oxide, the areas on the twoinner edges can be defined. Thus, first the wide portion then the narrowtrench is defined.

FIG. 24 illustrates deposition of backplate nitride underlayer 2402,which can be an LSN underlayer. The backplate nitride underlayer 2402can be deposited over and adjacent the fourth oxide layer 2202 andadjacent respective portions of the third oxide layer 2002.

The backplate nitride underlayer 2402 can improve robustness at the LES2 specification, which can be more than around 50 nm. The backplatenitride underlayer 2402 can improve the strength of the backplate. Forexample, the strength of the nitride can be higher than the strength ofthe polysilicon in the backplate (e.g., during bending, the nitrite hasa much higher breaking point compared to polysilicon). Therefore, havingthe nitride underlayers (e.g., the backplate nitride underlayer 2402)can improve the strength of the backplate.

FIG. 25 illustrates stages of a fabrication process for deposition of afirst backplate polysilicon layer. First backplate polysilicon layer2502 ₁ can be deposited over and adjacent the backplate nitrideunderlayer 2402. Stress anneal can also be performed. Further, at thesecond side 206, first backplate polysilicon layer 2502 ₁ can bedeposited over the second membrane nitride layer 1802 ₂. The firstbackplate polysilicon layer can also be referred to as a top backplateand is part of a rigid plate.

FIG. 26 illustrates deposition, structuring, and etching of a fifthoxide layer. The fifth oxide layer can be a stress distributor, alsoreferred to as a top backplate stress distributor. The fifth oxide layercan be deposited over the first backplate polysilicon layer 2502 andetched, forming two portions of the fifth oxide layer (indicated asfifth oxide layer 2602 ₁ and 2602 ₂). According to some implementations,the stress distribution can comprise nitride, oxide, or another materiallayer.

In this stage of the fabrication process, a (small) nitride layer (e.g.,fifth oxide layer 2602 ₁ and 2602 ₂) is added between the two backplaneparts (e.g., the top backplate as discussed with respect to FIG. 26 anda second backplate layer, which will be discussed with respect to FIG.27 below) in order to increase the bending stiffness at the suspensionof the backplate. The stress distributor can facilitate making thecomplete structure stiffer and more robust than the structure would bewithout the stress distributor.

A second layer of polysilicon (e.g., a second backplate polysiliconlayer 2702) can be deposited to form a second portion of the backplate,as illustrated in FIG. 27 . The second backplate polysilicon layer 2702can be deposited over the first backplate polysilicon layer 2502 and thefifth oxide layer (e.g., fifth oxide layer 2602 ₁ and 2602 ₂). The firstbackplate polysilicon layer 2502, the fifth oxide layer, and the secondbackplate polysilicon layer can form a rigid plate.

FIG. 28 illustrates definition (e.g., structuring) of the firstbackplate polysilicon layer 2502 and the second backplate polysiliconlayer 2702. For example, etching of the first backplate polysiliconlayer 2502 and the second backplate polysilicon layer 2702 can beperformed, as indicated, at 2802. Further, LSN hole structuring can beperformed.

Contact 1 opening integration can be performed during a next stage ofthe fabrication process, as illustrated in FIG. 29 . Opening the firstcontact can be facilitated via an oxide etch. For example, a firstcontact 2902 can be opened to the wafer 102 via the oxide etch. Further,second contacts 2904 ₁ and 2904 ₂ can be opened to bulk opening ofcontact to shield-contact. In an example, the first oxide can be etcheddry, and then the nitride layer can be etched in a pattern to contactthe membrane. FIG. 30 illustrates an LSN etch that integrates a secondcontact.

FIG. 31 illustrates metal deposition structuring and etch. One or moreportions of metal 3102 can be deposited within one or more secondcontacts 2904 ₁ and 2904 ₂. Accordingly, metal 3102 can be depositedover and adjacent the second backplate polysilicon layer 2702, over thefirst backplate polysilicon layer 2502, and over the nitridereinforcement layer 1302 ₁ and the first LSN thin film 202 ₁ (e.g., inthe first contact 2902). The metal 3102 can be etched such that onlyportions of the metal at the one or more second contacts remain. Thus, afirst portion of the metal 3102 can line the bottom and sides of secondcontact 2904 ₁. Further, a second portion of the metal 3102 can line thebottom and sides of second contact 2904 ₂.

During a next stage of the fabrication process, frontside protection andgrinding can be performed, as illustrated in FIG. 32 . As indicated,frontside oxide protection 3202 can be deposited over and adjacent thefirst backplate polysilicon layer 2502 and the metal 3102. Afterdeposition of the frontside oxide protection 3202, the wafer can bethinned to a desired thickness. For example, the wafer can be thinned to350 micron, for example.

Next, backside cavity definition and etch can be performed, asillustrated in FIG. 33 . As indicated frontside resist protection 3302can be provided. Further, a cavity 3304 can be defined on a backside(e.g., second side 206) of the wafer. Defining the cavity 3304 caninclude structuring and etching portions of the wafer 102 and respectiveportions of the backside layers (e.g., the second LSN thin film 202 ₂,the MPL 802 ₂, the second oxide layer 1102 ₂, the nitride reinforcementlayer 1302 ₂, the first membrane nitride layer 1402 ₂, and the secondmembrane nitride layer 1802 ₂.

The cavity 3304 can be defined between the centers of the respectivecenters of the front cavities (indicated by the first dashed line 602for the first cavity 302 ₁ and the second dashed line 604 for the secondcavity 302 ₂). According to an optional implementation, a photo resistfor Xenon Difluoride (XeF2) poly can be kept during a silicon removeprocess.

FIG. 34 illustrates a first release of the defined structure (e.g., thestructure fabricated with respect to FIGS. 1-33 ). The first release (orinitial release) can comprise Buffered Oxide Etch (BOE) pre-releaseusing buffered oxide that includes front resist removal, as illustratedin FIG. 35 . This process can be a wet pre-release process. During theBOE pre-release, the long distance, in the range of 20 micron laterally,is being etched. During the BOE pre-release the membrane is beingprotected by the thin polysilicon. The term “release” means that allsacrificial material should be removed. As illustrated in FIG. 34 , theresist is removed, then, in the next step, the sacrificial membraneprotection layer is removed. FIG. 36 illustrates the membrane protectionlayer. Thereafter, a second release of the structure can be facilitated.This can include removal of the polysilicon. The polysilicon can beremoved in a xenon difluoride process. Thereafter, the front side resistis removed. Further, a Self-Assembled Monolayer (SAM) coating can beapplied to the structure.

FIG. 37 illustrates example representation of a MEMS microphone 3700according to one or more embodiments described herein. Illustrated is afront cavity (e.g., the first cavity 302 ₁ and the second cavity 302 ₂),which are utilized to control bending of a flexible plate towards thecavity 3304. Further, there is no touching of the flexible plate at theedge of the cavity when the flexible plate moves towards the cavity. Forexample, the flexible plate moves or is deformed by a pressure wave.Controlling the movement can improve a robustness of the flexible platewhen it is deformed by the pressure wave. In some implementations, thepressure wave can include a threshold amplitude.

Additionally, membrane stoppers (illustrated as a first membrane stopper3702 and a second membrane stopper 3704) can assist with the control ofthe flexible plate. Since the microphone can be relatively large, thefront membrane and the membrane stoppers work together to stop orrestrict movement of the flexible plate downward. Also illustrated are alateral etch stop 3706 and a reverse bending edge, with lateral etchstop 3708.

The shield TP contact 3710 and a membrane node (raised to TP) 3712 arealso indicated on the MEMS microphone 3700. An LSN underlayer 3714 and adimple 3716 are also indicated in FIG. 37 . In the MEMS microphone 3700a membrane trench separates the active and the shield 3718. A buriedoxide stress reduction feature 3720 is also provided. Parasiticreduction (MEM—boot) 3722 and the bulk/boot node 3724 are indicated. TheMEMS microphone 3700 also includes membrane trench oxide on topreinforcement 3726.

FIG. 38 illustrates a further example representation of a MEMSmicrophone 3800 according to one or more embodiments described herein.Repetitive description of like elements employed in other embodimentsdescribed herein is omitted for sake of brevity. The MEMS microphone3800 can comprise one or more of the components and/or functionality ofthe MEMS microphone 3700 and vice versa. The MEMS microphone 3800 issimilar to the MEMS microphone 3700 but does not include the oxidereinforcement (e.g., the membrane trench oxide on top reinforcement3726). It is noted that the perforated flexible plate can improve thesignal. Accordingly, reinforcement of the trench has been provideherein. The reinforcement can be oxide, nitride, or another material.

FIG. 39 illustrates another example representation of a MEMS microphoneaccording to one or more embodiments described herein. Repetitivedescription of like elements employed in other embodiments describedherein is omitted for sake of brevity. The MEMS microphone 3900 cancomprise one or more of the components and/or functionality of the MEMSmicrophone 3700, the MEMS microphone 3800, and vice versa. The MEMSmicrophone 3900 is similar to the MEMS microphone 3800. However, theMEMS microphone 3900 includes bottom LSN reinforcement 3902.

Reference throughout this specification to “one embodiment,” or “anembodiment,” means that a particular feature, structure, orcharacteristic described in connection with the embodiment is includedin at least one embodiment. Thus, the appearances of the phrase “in oneembodiment,” “in one aspect,” or “in an embodiment,” in various placesthroughout this specification are not necessarily all referring to thesame embodiment. Furthermore, the particular features, structures, orcharacteristics can be combined in any suitable manner in one or moreembodiments.

In addition, the words “example” and “exemplary” are used herein to meanserving as an instance or illustration. Any embodiment or designdescribed herein as “example” or “exemplary” is not necessarily to beconstrued as preferred or advantageous over other embodiments ordesigns. Rather, use of the word example or exemplary is intended topresent concepts in a concrete fashion. As used in this application, theterm “or” is intended to mean an inclusive “or” rather than an exclusive“or.” That is, unless specified otherwise or clear from context, “Xemploys A or B” is intended to mean any of the natural inclusivepermutations. That is, if X employs A; X employs B; or X employs both Aand B, then “X employs A or B” is satisfied under any of the foregoinginstances. In addition, the articles “a” and “an” as used in thisapplication and the appended claims should generally be construed tomean “one or more” unless specified otherwise or clear from context tobe directed to a singular form.

In addition, the various embodiments can be implemented as a method,apparatus, or article of manufacture using standard programming and/orengineering techniques to produce software, firmware, hardware, or anycombination thereof to control a computer to implement the disclosedsubject matter. The term “article of manufacture” as used herein isintended to encompass a computer program accessible from anycomputer-readable device, machine-readable device, computer-readablecarrier, computer-readable media, machine-readable media,computer-readable (or machine-readable) storage/communication media. Forexample, computer-readable media can comprise, but are not limited to, amagnetic storage device, e.g., hard disk; floppy disk; magneticstrip(s); an optical disk (e.g., compact disk (CD), a digital video disc(DVD), a Blu-ray Disc™ (BD)); a smart card; a flash memory device (e.g.,card, stick, key drive); and/or a virtual device that emulates a storagedevice and/or any of the above computer-readable media. Of course, thoseskilled in the art will recognize many modifications can be made to thisconfiguration without departing from the scope or spirit of the variousembodiments

The above description of illustrated embodiments of the subjectdisclosure, including what is described in the Abstract, is not intendedto be exhaustive or to limit the disclosed embodiments to the preciseforms disclosed. While specific embodiments and examples are describedherein for illustrative purposes, various modifications are possiblethat are considered within the scope of such embodiments and examples,as those skilled in the relevant art can recognize.

In this regard, while the subject matter has been described herein inconnection with various embodiments and corresponding figures, whereapplicable, it is to be understood that other similar embodiments can beused or modifications and additions can be made to the describedembodiments for performing the same, similar, alternative, or substitutefunction of the disclosed subject matter without deviating therefrom.Therefore, the disclosed subject matter should not be limited to anysingle embodiment described herein, but rather should be construed inbreadth and scope in accordance with the appended claims below.

What is claimed is:
 1. A microelectromechanical microphone devicecomprising: a flexible plate that is deformable by a pressure wave, theflexible plate comprising a reverse bending edge comprising a firstlateral etch stop comprising a first corner radius and a second lateraletch stop comprising a second corner radius different than the firstcorner radius; a rigid plate mechanically coupled to the flexible plate,the rigid plate comprising openings configured to permit passage of thepressure wave; and a stoppage member affixed to the rigid plate andextending perpendicular relative to a surface of the rigid plateopposite the surface of the flexible plate, wherein the stoppage memberis configured to limit motion of the flexible plate in response to thepressure wave.
 2. The microelectromechanical microphone device of claim1, wherein the first corner radius is more than 100 nanometers, andwherein the second corner radius is more than 25 nanometers.
 3. Themicroelectromechanical microphone device of claim 2, wherein a lateralstep width between the first corner radius and the second corner radiusis less than around 4 micrometers.
 4. The microelectromechanicalmicrophone device of claim 1, wherein the rigid plate comprises a stressdistributor located between layers of polysilicon.
 5. Themicroelectromechanical microphone device of claim 4, wherein the stressdistributor comprises a nitride layer.
 6. A microelectromechanicalmicrophone device comprising: a flexible plate that is deformable by apressure wave; a rigid plate mechanically coupled to the flexible plate,the rigid plate comprising openings configured to permit passage of thepressure wave and a ring-shaped mechanical stress distributor; and astoppage member affixed to the rigid plate and extending perpendicularrelative to a surface of the rigid plate opposite the surface of theflexible plate, wherein the stoppage member is configured to limitmotion of the flexible plate in response to the pressure wave includinga threshold amplitude.
 7. The microelectromechanical microphone deviceof claim 6, wherein the stress distributor comprises nitride.
 8. Themicroelectromechanical microphone device of claim 6, wherein the rigidplate comprises a reverse bending edge comprising a first lateral etchstop comprising a first corner radius and a second lateral etch stopcomprising a second corner radius different than the first cornerradius.
 9. The microelectromechanical microphone device of claim 8,wherein the first corner radius is more than wo nanometers, and whereinthe second corner radius is more than 25 nanometers.
 10. Themicroelectromechanical microphone device of claim 8, wherein a lateralstep width between the first corner radius and the second corner radiusis less than around 4 micrometers.
 11. The microelectromechanicalmicrophone device of claim 6, wherein the stress distributor comprisesoxide.
 12. The microelectromechanical microphone device of claim 6,wherein the stress distributor comprises a material layer.
 13. Amicroelectromechanical microphone device comprising: a flexible platethat is deformable by a pressure wave; a rigid plate mechanicallycoupled to the flexible plate, the rigid plate comprising openingsconfigured to permit passage of the pressure wave and a stressdistributor; and a stoppage member affixed to the rigid plate andextending perpendicular relative to a surface of the rigid plateopposite the surface of the flexible plate, wherein the stoppage memberis configured to limit motion of the flexible plate in response to thepressure wave including a threshold amplitude, wherein the rigid platecomprises a reverse bending edge comprising a first lateral etch stopcomprising a first corner radius and a second lateral etch stopcomprising a second corner radius different than the first cornerradius.
 14. The microelectromechanical microphone device of claim 13,wherein the first corner radius is more than 100 nanometers, and whereinthe second corner radius is more than 25 nanometers.
 15. Themicroelectromechanical microphone device of claim 13, wherein a lateralstep width between the first corner radius and the second corner radiusis less than around 4 micrometers.
 16. The microelectromechanicalmicrophone device of claim 13, wherein the stress distributor comprisesnitride.
 17. The microelectromechanical microphone device of claim 13,wherein the stress distributor comprises oxide.
 18. Themicroelectromechanical microphone device of claim 13, wherein the stressdistributor comprises a material layer.